100% material declaration data sheet TQG176 pk127 (v1.2) september 28, 2006 ma terial declaration data sheet average weight: 1.776259 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.02752 1.55% silicon 7440-21-3 100.00 0.02752 die attach material 0.003709 0.21% anhydride trade secret 7.50 0.000278175 silver 7440-22-4 77.50 0.002874475 epoxy resin trade secret 15.00 0.00055635 mold compound 1.465 82.48% epoxy resin (ep) trade secret 7.00 0.10255 phenolic resin trade secret 5.00 0.07325 carbon black 1333-86-4 0.30 0.004395 silica 60676-86-0 87.70 1.284805 leadframe 0.2601 14.64% copper 7440-50-8 94.3 0.2452743 magnesium 7439-95-4 0.30 0.0007803 nickel 7440-02-0 1.2 0.0031212 silicon 7440-21-3 4.2 0.0109242 bond wire 0.00393 0.22% gold 7440-57-5 100.00 0.00393 ext. plating 0.016 0.90% tin 7440-31-5 100.00 0.016 pk127 (v1.2) september 28, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? TQG176 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 2/09/06 1.0 initial release. 7/10/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. pk127 (v1.2) september 28, 2006
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